IPC 9641-2013 标准详情
- 标准号:IPC 9641-2013
- 中文标题:高温印刷电路板平整度指南
- 英文标题:High Temperature Printed Board Flatness Guideline
- 标准类别:电子互联协会IPC(美国印刷电路协会)
- 发布日期:2013-06-01
Defines a test method which helps in measuring the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range of temperatures typical during surface mount and t
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