ASTM F459-2006 标准详情
- 标准号:ASTM F459-2006
- 中文标题:微电子器件金属丝连接抗拉强度测量的标准试验方法
- 英文标题:Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
- 标准类别:美国材料与试验协会ASTM
- 发布日期:2006
Failure of microelectronic devices is often due to failure of an interconnection bond. A common type of interconnection bond is a wire bond. These methods can assist in maintaining control of the process of making wire bonds. They can be used to dist
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