DIN EN 61190-1-3 (2015-05) 标准详情
- 标准号：DIN EN 61190-1-3 (2015-05)
- 中文标题：
- 英文标题：Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)
- 标准类别：德国标准DIN
- 发布日期：
