IEC 60749-15 Edition 2.0-2010 半导体器件.机械和气候试验方法.第15部分:透孔安装设备对焊接温度的抗性
IEC 60749-15 Edition 2.0-2010 标准详情
- 标准号：IEC 60749-15 Edition 2.0-2010
- 中文标题：半导体器件.机械和气候试验方法.第15部分:透孔安装设备对焊接温度的抗性
- 英文标题：Semiconductor devices – Mechanical and climatic test methods.
Part 15: Resistance to soldering temperature for through-hole mounted devices
- 标准类别：国际电工委员会IEC
- 发布日期：2010-10-01
内容简介
This part of IEC 60749 describes a test used to determine whether encapsulated solid statedevices used for through-hole mounting can withstand the effects of the temperature to whichthey are subjected during soldering of their leads by using wave sol
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