NEN NPR IEC/PAS 60191-6-18-2008
NEN NPR IEC/PAS 60191-6-18-2008 标准详情
- 标准号：NEN NPR IEC/PAS 60191-6-18-2008
- 中文标题：
- 英文标题：Mechanical Standardization Of Semiconductor Devices - Part 6-18: General Rules For The Preparation Of Outline Drawings Of Surface Mounted Semiconductor Device Packages - Design Guide For Ball Grid Array (bga)
- 标准类别：荷兰国家标准NEN
- 发布日期：
内容简介
Defines common outline drawings and dimensions for all types of structures and composed materials of ball grid array (hereinafter called BGA), whose terminal pitch is one millimetre or larger and whose package body outline is square.
* 特别声明：资源收集自网络或用户上传，本网站所提供的电子文本仅供参考，请以正式出版物为准。仅供个人标准化学习，研究使用。如有侵权，请及时联系我们！
