IPC TR-578-1984 领先的制造技术报告,在硬度,裸铜,双面印刷电路板等方面的最低导体宽度和镀金直通孔循环赛研究
IPC TR-578-1984 标准详情
- 标准号：IPC TR-578-1984
- 中文标题：领先的制造技术报告,在硬度,裸铜,双面印刷电路板等方面的最低导体宽度和镀金直通孔循环赛研究
- 英文标题：leading edge manufacturing technology report results of a round robin study on minimum conductor width and plated-through holes in rigid, bare copper, double sided printed wiring boards
- 标准类别：电子互联行业协会标准(美国印刷电路行业协会)
- 发布日期：1984-01-01
内容简介
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory onlyand its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or
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