IPC 7093-2011 标准详情
- 标准号:IPC 7093-2011
- 中文标题:
- 英文标题:design and assembly process implementation for bottom termination components
- 标准类别:电子互联行业协会标准(美国印刷电路行业协会)
- 发布日期:2011-03-01
Specifies the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body.
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