NBN EN 60749-20-1-2009 标准详情
- 标准号：NBN EN 60749-20-1-2009
- 中文标题：
- 英文标题：Semiconductor Devices - Mechanical And Climatic Test Methods - Part 20-1: Handling, Packing, Labelling And Shipping Of Surface-mount Devices Sensitive To The Combined Effect Of Moisture And Soldering Heat
- 标准类别：比利时标准NBN
- 发布日期：
