DIN EN 60191-6-1-2002 半导体器件的机械标准化.第6-1部分:表面安装半导体器件包装的外形图制备总则.鸥翼导入端的设计导则
DIN EN 60191-6-1-2002 标准详情
- 标准号：DIN EN 60191-6-1-2002
- 中文标题：半导体器件的机械标准化.第6-1部分:表面安装半导体器件包装的外形图制备总则.鸥翼导入端的设计导则
- 英文标题：mechanical standardization of semiconductor devices - part 6-1: general rules for the preparation of outline drawings of surface mounted semiconductor device packages; design guide for gull-wing lead terminals iec 60191-6-1:2001 ; german version en
- 标准类别：德国标准
- 发布日期：2002-08
内容简介
The document covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4. This publication is intended to establish commo
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