JEDEC JESD51-3-1996 标准详情
- 标准号:JEDEC JESD51-3-1996
- 中文标题:有引线的表面安装包装的低效导热性测试板
- 英文标题:low effective thermal conductivity test board for leaded surface mount packages
- 标准类别:电子元件工业联合会标准JEDEC
- 发布日期:1996-01-01
This specification covers leaded surface mount components of lead pitch greater than 0.35mm up to a body size of 48 mm. It is not intended for through-hole, ball grid array, orsocketed components. See the appropriate test specifications for these pac
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