JEDEC JESD22-B106D-2008 标准详情
- 标准号:JEDEC JESD22-B106D-2008
- 中文标题:通孔安装装置用焊料冲击阻力
- 英文标题:resistance to solder shock for through-hole mounted devices
- 标准类别:电子元件工业联合会标准JEDEC
- 发布日期:2008-04-01
This test method is used to determine whether solid state devices can withstand the effect of thetemperature shock to which they will be subjected during soldering of their leads in a solderwaveprocess and/or solder fountain (rework/replacement) proc
* 特别声明:资源收集自网络或用户上传,本网站所提供的电子文本仅供参考,请以正式出版物为准。仅供个人标准化学习,研究使用。如有侵权,请及时联系我们!
