IEC 60749-37-2008 标准详情
- 标准号:IEC 60749-37-2008
- 中文标题:半导体装置.机械和气候试验方法.第37部分:用加速计的电路板级落锤试验方法
- 英文标题:Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
- 标准类别:国际电工委员会标准
- 发布日期:2008-01
This part of IEC 60749 provides a test method that is intended to evaluate and compare dropperformance of surface mount electronic components for handheld electronic productapplications in an accelerated test environment, where excessive flexure of a
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